Huntsman Advanced Materials: Silver-filled Epoxy Die Attach Adhesive

Wednesday, January 24, 2007

A one-component, silver-filled epoxy adhesive that combines high electrical and thermal conductivity with good bond strength was introduced today by Huntsman Advanced Materials. ARALDITE® 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards. The high-speed dispensable material features an extended work life of up to four days at room temperature and cures quickly in one hour at 165ºC (329ºF). ARALDITE 7047 silver-filled epoxy is formulated without solvents or viscosity diluents to reduce potential outgassing. With its high-temperature performance, the new product is compatible with lead-free processing. Once cured, it exhibits an aluminum/ aluminum lap shear strength of 1300 psi and gold/gold die shear of 1700 psi at room temperature. Volume resistivity at room temperature is <0.0002 ohm-cm, even after 1000 hours aging. The epoxy has a glass transition temperature of 130ºC (266ºF) and coefficient of thermal expansion of 72 ppm/ºC.

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http://www.araldite-adhesives.com

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