Master Bond, Inc.: Epoxy System with Remarkably High Peel Strength is Serviceable at Cryogenic Temperatures

Monday, October 06, 2008

Master Bond Inc., Hackensack, N.J. has introduced a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation called EP21TDC-2. The cured compound has remarkably high peel strength of more than 30 pounds per linear inch (pli) along with an elongation of over 150%.  EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections.  Versatile cure schedules include a fast 2-3 hour cure at a low 93°C, in addition to the standard room temperature cure. EP21TDC-2 has wide applicability as both an adhesive and sealant in cryogenic environments.  Its service temperature range is 4°K to 121°C (250°F).  
 
EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration.  The cured epoxy is a superior electrical and thermal insulator with outstanding exposure resistance to water, oils, hydraulic fluids, bases and salts. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. Master Bond EP21TDC-2 is recommended for use wherever excellent flexibility and its related properties are desired, especially in cryogenic temperature applications.  It is available in premixed bi-packs and cartridge/gun packaging for convenient dispensing as well as in pint, quart, gallon and 5 gallon containers.

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